Multilayer electronic component and method for manufacturing multilayer electronic component

Abstract

A multilayer electronic component includes a multilayer body including a plurality of stacked dielectric layers and a plurality of internal electrode layers between adjacent dielectric layers of the plurality of stacked dielectric layers. The plurality of stacked dielectric layers each have a plurality of crystal grains including a first phase. The multilayer body defines an electrode facing portion where the plurality of internal electrode layers and the plurality of stacked dielectric layers face each other, and defines an external peripheral portion surrounding the electrode facing portion. A portion of the plurality of stacked dielectric layers in the external peripheral portion include, in at least some of grain boundaries of the plurality of crystal grains, a second phase including at least one of Sn, Cu, Fe, Ni, Cr, Mn, V, Al, and P, and the second phase is a different compound from the first phase.