The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Aug. 05, 2022
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Yahong Xiong, Taoyuan, TW;

Da Jin, Taoyuan, TW;

Qinghua Su, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01F 27/28 (2006.01); G05F 1/575 (2006.01); H01F 27/02 (2006.01); H01F 27/29 (2006.01); G06F 1/18 (2006.01); H01F 17/04 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H01L 25/16 (2023.01); H01R 12/52 (2011.01); H01R 12/58 (2011.01); H02M 3/158 (2006.01); H05K 1/11 (2006.01); H01F 17/06 (2006.01); H02M 3/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); G05F 1/575 (2013.01); G06F 1/183 (2013.01); H01F 17/04 (2013.01); H01F 17/06 (2013.01); H01F 27/02 (2013.01); H01F 27/292 (2013.01); H01L 25/16 (2013.01); H01R 12/52 (2013.01); H01R 12/58 (2013.01); H02M 3/003 (2021.05); H02M 3/1584 (2013.01); H05K 1/0203 (2013.01); H05K 1/111 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 1/186 (2013.01); H05K 7/1427 (2013.01); H05K 7/2089 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10636 (2013.01);
Abstract

An electronic device includes a system board, a power module and a conductive part. The system board includes a first surface and a second surface opposite to each other. The power module is disposed on the second surface and provides power to the semiconductor device through the system board. The conductive part is disposed on a first side of the power module adjacent to the second surface, wherein the conductive part is electrically connected with the and the system board, wherein the power is transmitted between the and the semiconductor device through the conductive part. The power module includes at least one switch circuit and a magnetic core assembly. The at least one switch circuit disposed on a second side of the power module away from the conductive part. The magnetic core assembly is arranged between the switch circuit and the conductive part.


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