The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Apr. 03, 2019
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Yoshifumi Maki, Nagaokakyo, JP;

Takuya Ishida, Nagaokakyo, JP;

Shinya Hirai, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); C04B 35/26 (2006.01); H01F 41/04 (2006.01); C04B 41/00 (2006.01); H01G 4/232 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); C04B 41/45 (2006.01); C04B 41/88 (2006.01); H01G 4/30 (2006.01); H01F 41/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); C04B 35/26 (2013.01); C04B 41/009 (2013.01); C04B 41/4564 (2013.01); C04B 41/88 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 41/10 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); Y10T 29/4902 (2015.01);
Abstract

A method of manufacturing an electronic component capable of preventing entrance of a plating solution and a flux component at an interface to which an inner electrode of a ceramic element body is extended, and capable of forming an outer electrode of an arbitrary shape. A ceramic element body is made of a ceramic material containing a metal oxide, and part of an inner electrode is extended to extended surfaces of the ceramic element body. A base electrode is formed on each of the extended surfaces using a conductive paste to be connected to the inner electrode. Part of another surface of the ceramic element body adjacent to the extended surfaces is locally heated, and part of the metal oxide is reduced to form a reformed portion. A plating electrode is continuously formed over the base electrode and the reformed portion through a plating method to form outer electrodes.


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