The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Apr. 03, 2020
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jaeyoung Huh, Suwon-si, KR;

Kyungwan Park, Suwon-si, KR;

Jungho Bae, Suwon-si, KR;

Boram Kim, Suwon-si, KR;

Youngjin Kim, Suwon-si, KR;

Hyun Kim, Suwon-si, KR;

Byeonghoon Park, Suwon-si, KR;

Yoonsun Park, Suwon-si, KR;

Woontahk Sung, Suwon-si, KR;

Kyungwoo Lee, Suwon-si, KR;

Kihoon Jang, Suwon-si, KR;

Younho Choi, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 7/481 (2006.01); H01S 5/024 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); G03B 17/55 (2021.01); H01S 5/02 (2006.01); H05K 7/20 (2006.01); G01S 17/10 (2020.01); H01S 5/023 (2021.01); H01S 5/0233 (2021.01); H01S 5/0235 (2021.01);
U.S. Cl.
CPC ...
G01S 7/4813 (2013.01); G01S 7/4814 (2013.01); G01S 7/4816 (2013.01); G01S 17/10 (2013.01); G03B 17/55 (2013.01); H01S 5/023 (2021.01); H01S 5/0233 (2021.01); H01S 5/0235 (2021.01); H01S 5/02438 (2013.01); H01S 5/02469 (2013.01); H01S 5/02476 (2013.01); H05K 1/0204 (2013.01); H05K 1/144 (2013.01); H05K 5/0017 (2013.01); H05K 7/20336 (2013.01); H05K 7/20472 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10121 (2013.01);
Abstract

An electronic device including a heat-radiant structure of a camera is provided. The electronic device includes a housing including a front plate, a back plate, an image sensor to receive light through a first region of the back plate, and a laser emitter to emit light through a second region of the back plate, a laser driver, a housing structure surrounding at least a part of a side face of the image sensor and driver, a first metal structure, a first heat transfer member including a first portion, a second portion, and a third portion extended from the second portion to a space between the driver and the front plate, a second heat transfer member extended from the third portion of the first heat transfer member, and a first thermal interface material (TIM) disposed between the second heat transfer member and the front plate.


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