The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Jun. 14, 2021
Applicant:

Hanon Systems, Daejeon, KR;

Inventors:

Petr Kolder, Ro{hacek over (z)}nov pod Radho{hacek over (s)}t{hacek over (e)}m, CZ;

Martin Bohac, Ostrava, CZ;

Martin Sopuch, {hacek over (Z)}enklava, CZ;

Milan Chytrý, Nový Ji{hacek over (c)}ín, CZ;

Leo Somhorst, Kerpen, DE;

Assignee:

Hanon Systems, Daejeon, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 1/00 (2006.01); F28F 9/00 (2006.01); F02B 29/04 (2006.01); F28D 7/10 (2006.01); F28D 7/00 (2006.01); F28D 7/16 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28F 9/001 (2013.01); F02B 29/0462 (2013.01); F28D 7/0025 (2013.01); F28D 7/10 (2013.01); F28D 7/1684 (2013.01); F28D 2021/0082 (2013.01);
Abstract

Device for heat transfer between a first fluid and one second fluid includes a housing with first housing element, second housing element and heat transfer element. Housing is developed with a first connecting fitting and a second connecting fitting for each fluid. Heat transfer element is disposed in a volume completely enclosed in a housing and is developed for through-conduction of the first fluid. Housing is developed for conduction of the second fluid about the heat transfer element. Connecting fittings for second fluid are either disposed on the first housing element and the connecting fittings for the first fluid are disposed on the second housing element, wherein within the second housing at least one flow path for conducting the first fluid is implemented which extends between a connecting fitting and a collector region or the connecting fittings for the fluids are disposed on the first housing element.


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