The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Jan. 09, 2018
Applicant:
Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;
Inventors:
Assignee:
SUMITOMO SEIKA CHEMICALS CO.. LTD., Hyogo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); C08G 59/42 (2006.01); C08G 59/38 (2006.01); C08G 59/68 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01); H01L 23/29 (2006.01); C08G 59/24 (2006.01); C08G 59/62 (2006.01); C09D 7/65 (2018.01); C09J 11/08 (2006.01); C09K 3/10 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/306 (2013.01); C08G 59/3281 (2013.01); C08G 59/38 (2013.01); C08G 59/4215 (2013.01); C08G 59/686 (2013.01);
Abstract
Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.