The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2023
Filed:
Sep. 30, 2022
Techno-umg Co., Ltd., Tokyo, JP;
Shinji Fujii, Tokyo, JP;
Naruki Tanaka, Tokyo, JP;
TECHNO-UMG CO., LTD., Tokyo, JP;
Abstract
A thermoplastic resin composition includes a resin component (A) in an amount of 97 to 80 parts by mass; and a hitting sound reducing material (B) in an amount of 3 to 20 parts by mass. The hitting sound reducing material (B) is a hydrogenated copolymer derived from hydrogenation of a copolymer formed of a block portion (I) primarily including structural units derived from an aromatic vinyl-based compound, and a random portion (II) primarily including structural units derived from an aromatic vinyl-based compound and derived from butadiene. The structural units derived from an aromatic vinyl-based compound in the block portion (I) and derived from an aromatic vinyl-based compound in the random portion (II) are present in a total content of 55 to 80 mass % relative to a 100 total mass % of the copolymer, and the hydrogenated copolymer has a primary dispersion peak of tan δ at 0° C. or greater.