The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Jun. 28, 2019
Applicants:

Suncorona Oda Co., Ltd., Ishikawa, JP;

Kanazawa Institute of Technology, Ishikawa, JP;

Inventors:

Keisuke Sone, Kanazawa, JP;

Masaki Kobayashi, Komatsu, JP;

Hirofumi Nishida, Nonoichi, JP;

Kiyoshi Uzawa, Nonoichi, JP;

Hisai Ueda, Nonoichi, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08K 3/04 (2006.01); C08K 7/06 (2006.01);
U.S. Cl.
CPC ...
C08J 5/243 (2021.05); C08K 3/04 (2013.01); C08K 7/06 (2013.01); C08J 2363/00 (2013.01);
Abstract

An object of the present invention is to provide a fiber-reinforced thermoplastic resin sheet which can be manufactured into a molded body exhibiting excellent appearance quality as well as exhibits both high moldability and strength and a manufacturing method of such a fiber-reinforced thermoplastic resin sheet. The present invention relates to a fiber-reinforced thermoplastic resin sheet which is a random laminated body of a tape-shaped unidirectional prepreg and contains spread reinforcement fibers and a polymer (a) and in which the polymer (a) is a polymer of at least a bisphenol A type epoxy compound represented by Formula (1): where n is an integer of 1 to 4and a bisphenol compound selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol E, and bisphenol P.


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