The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Mar. 29, 2019
Applicant:

Evonik Operations Gmbh, Essen, DE;

Inventors:

Gauri Sankar Lal, Whitehall, PA (US);

Michael Cook, Macungie, PA (US);

Gamini Ananda Vedage, Bethlehem, PA (US);

Emmanouil Roumpelakis, Breinigsville, PA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/50 (2006.01); C07C 213/00 (2006.01); C07C 215/50 (2006.01); C08G 59/32 (2006.01); C09D 163/00 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08G 59/5033 (2013.01); C07C 213/00 (2013.01); C07C 215/50 (2013.01); C08G 59/3218 (2013.01); C09D 163/00 (2013.01); C09J 163/00 (2013.01);
Abstract

The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.


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