The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Oct. 20, 2021
Applicants:

Yong Jia Chen, Dongguan, CN;

Earl Brohard, Groveland, CA (US);

Inventors:

Yong Jia Chen, Dongguan, CN;

Earl Brohard, Groveland, CA (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41K 1/02 (2006.01); B41K 1/38 (2006.01); C23F 1/02 (2006.01); B05D 1/04 (2006.01); B44C 1/24 (2006.01); B41K 1/34 (2006.01);
U.S. Cl.
CPC ...
B41K 1/02 (2013.01); B05D 1/04 (2013.01); B41K 1/34 (2013.01); B44C 1/24 (2013.01); C23F 1/02 (2013.01); B05D 2202/10 (2013.01); B05D 2530/00 (2013.01);
Abstract

A metallic stamp and die for the craft industry comprises a predetermined acid-etched design on a surface of a metallic plate. A first layer of a metallic paint is applied over the front and back surfaces of the metallic stamp and die. A second layer of a rubber paint is applied over the metallic paint. The metallic paint facilitates bonding of the rubber paint to the metallic plate and increases the life of the coating of the rubber paint. The rubber paint is configured to absorb and store an ink and facilitate transfer of the ink to one or more substrates, thus enabling stamping of the design on the substrate. The metallic die can be configured for a plurality of uses, such as embossing, cutting, heat-foiling, stamping, scoring, and inserting patterns or designs in a plurality of substrates.


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