The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

May. 26, 2020
Applicant:

Fanuc Corporation, Yamanashi, JP;

Inventor:

Shinichi Ozeki, Yamanashi, JP;

Assignee:

FANUC CORPORATION, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/17 (2020.01); G06N 20/00 (2019.01); B29C 33/38 (2006.01); G06F 113/22 (2020.01);
U.S. Cl.
CPC ...
B29C 33/3835 (2013.01); G06F 30/17 (2020.01); G06N 20/00 (2019.01); G06F 2113/22 (2020.01);
Abstract

A molding shrinkage ratio is predicted according to molding conditions set in advance in designing a mold. A machine learning device includes an input data acquiring unit that acquires input data including any molding condition including a type of resin, a type of additive, a blending ratio of the additive, a surface temperature of a mold, and a product of a holding pressure and a holding pressure time for any article molded by any injection molding machine, a label acquiring unit that acquires label data indicating a molding shrinkage ratio in a flow direction and a molding shrinkage ratio in a vertical direction perpendicular to the flow direction of a resin measured of the article molded at the molding condition, and a learning unit that executes supervised learning using the input data and the label data, and generates a learned model.


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