The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2023

Filed:

Nov. 20, 2017
Applicant:

Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;

Inventors:

Friedhold Schölz, Hanau, DE;

Egbert Stiedl, Hanau, DE;

Bernd Spaniol, Hanau, DE;

Norbert Traeger, Hanau, DE;

Werner Feuring, Hanau, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 11/10 (2006.01); B23D 57/00 (2006.01); B23D 59/02 (2006.01); B23D 59/04 (2006.01); C25D 11/26 (2006.01);
U.S. Cl.
CPC ...
B23Q 11/1061 (2013.01); C25D 11/26 (2013.01); B23D 57/003 (2013.01); B23D 59/02 (2013.01); B23D 59/04 (2013.01);
Abstract

The invention relates to a method for cutting refractory metals, in which a solid body () made of a refractory metal is mechanically machining cut with a cutting apparatus (), wherein the cutting apparatus () is wetted for cutting with a fluid () having at least 50 weight % water, wherein the cutting apparatus () is brought to a positive electrical potential in relation to the solid body () during cutting. The invention also relates to a disc produced from a refractory metal using such a method, and such a disc that has an oxide layer with a thickness of between 2 nm and 1,000 nm on the cutting surface.


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