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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11602800 B1

PDFFull Text
Date of Patent:
Mar. 14, 2023

Filed:

Oct. 10, 2019

Systems and methods for providing an interface on a printed circuit board using pin solder enhancement

Applicant:

Eagle Technology, Llc, Melbourne, FL (US);

Inventors:

Michael T. De Roy, Melbourne, FL (US);

Phillip K. Nickel, Palm Bay, FL (US);

Jay S. Nelson, Palm Bay, FL (US);

Andres M. Gonzalez, Melbourne, FL (US);

William A. Marquart, Melbourne, FL (US);

Assignee:

EAGLE TECHNOLOGY, LLC, Melbourne, FL (US);

Attorneys:

Fox Rothschild LLP

Robert Sacco

Carol Thorstad-Forsyth

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/535 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0623 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/3735 (2013.01); H05K 3/3468 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15312 (2013.01);
Abstract

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wetable surface of a planar substrate; aligning the pin with the solder disposed on the non-wetable surface of the planar substrate; inserting the pin in the solder; and performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

Find Patent Forward Citations

De Roy, Michael. (2023). Systems and methods for providing an interface on a printed circuit board using pin solder enhancement (U.S. Patent No. 11602800). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11602800

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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