The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Aug. 31, 2021
Applicant:

Realtek Semiconductor Corp., Hsinchu, TW;

Inventors:

Chia-Liang (Leon) Lin, Fremont, CA (US);

Ting-Hsu Chien, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/42 (2006.01); H03F 3/16 (2006.01); H03F 3/45 (2006.01);
U.S. Cl.
CPC ...
H03F 1/42 (2013.01); H03F 3/16 (2013.01); H03F 2200/36 (2013.01);
Abstract

A multi-stage amplifier includes a first stage comprising a first common-source amplifier, a first inductive load network comprising a serial connection of a first load resistor and a first load inductor, and a first source network configured to receive a first signal and output a first load signal, and a first inter-stage inductor configured to couple the first load signal to a second signal; and a second stage comprising a second common-source amplifier, a second inductive load network comprising a serial connection of a second load resistor and a second load inductor, and a second source network configured to receive the second signal and output a second load signal, and a second inter-stage inductor configured to couple the second load signal to a third signal, wherein the first load inductor and the second load inductor are laid out to enhance an inter-stage inductive coupling.


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