The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jun. 18, 2019
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Chengyue Yu, San Diego, CA (US);

Zhen Ning Low, San Diego, CA (US);

Guoyong Guo, San Jose, CA (US);

Jiwei Chen, Fremont, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 3/156 (2006.01); G06F 1/3287 (2019.01); H01L 23/50 (2006.01); H01L 23/00 (2006.01); H02M 3/07 (2006.01); H02M 3/158 (2006.01); H02M 7/483 (2007.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H02M 3/156 (2013.01); G06F 1/3287 (2013.01); H01L 23/50 (2013.01); H01L 24/01 (2013.01); H02M 3/07 (2013.01); H02M 3/1582 (2013.01); H02M 7/483 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19042 (2013.01); H02M 1/0003 (2021.05); H02M 1/009 (2021.05); H02M 3/1586 (2021.05);
Abstract

Certain aspects of the present disclosure generally relate to a connection terminal pattern and layout for a three-level buck regulator. One example electronic module generally includes a substrate, an integrated circuit (IC) package disposed on the substrate and comprising transistors of a three-level buck regulator, a capacitive element of the three-level buck regulator disposed on the substrate, and an inductive element of the three-level buck regulator disposed on the substrate. In certain aspects, the capacitive element and the inductive element may be disposed adjacent to different sides of the IC package.


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