The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Dec. 14, 2017
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Yosuke Takai, Tokyo, JP;
Toshiyasu Ito, Tokyo, JP;
YAMAICHI ELECTRONICS CO., LTD., Tokyo, JP;
Abstract
A group of contact pads (EB) formed on a lower surface (B) at a connection end of a board portion of an optical module board () includes, in order from the endmost end, a contact pad (B) conducting to a ground line (G), contact pads (B) and (B) conducting to transmission-side high-speed signal lines (S), a contact pad (B) conducting to the ground line (G), contact pads (BB, andB) conducting to low-speed signal lines (S), a contact pad (B) conducting to the ground line (G), contact pads (BandB) conducting to receiving-side high-speed signal lines (S), and a contact pad (B) conducting to the ground line (G). Fixed terminal portions of a plurality of contact terminals () connected to the contact pads (BandB) conducting to the transmission-side high-speed signal lines (S) and the contact pads (BandB) conducting to the receiving-side high-speed signal lines (S) in a host connector () are electrically connected to conductive paths (THL,RHL), which are continuous with high-speed signal lines formed on a plane shared with electrode portions (BEBEBE, andBE) via the electrode portions (BEBEBE, andBE) of a printed wiring board ().