The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jan. 19, 2022
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Kazuma Kozuru, Tokushima, JP;
Ryota Okuno, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/10 (2010.01); H01S 5/00 (2006.01); H01S 5/022 (2021.01); H01S 5/02253 (2021.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/005 (2013.01); H01L 33/10 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01S 5/00 (2013.01); H01S 5/022 (2013.01); H01S 5/02253 (2021.01);
Abstract
A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.