The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jan. 16, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Heungkyu Kwon, Seongnam-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 25/162 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01);
Abstract
A semiconductor module may include a system board including a top surface and a bottom surface, a module substrate provided on the top surface of the system board, a system semiconductor package mounted on the module substrate, and first and second power management semiconductor packages mounted on the module substrate. The first and second power management semiconductor packages may be spaced apart from each other in a first direction, which is parallel to a top surface of the module substrate, with the system semiconductor package interposed therebetween.