The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jan. 29, 2021
Applicant:
Google Llc, Mountain View, CA (US);
Inventors:
Zhimin Jamie Yao, Santa Barbara, CA (US);
Bob Benjamin Buckley, Santa Barbara, CA (US);
Assignee:
GOOGLE LLC, Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06N 10/00 (2022.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); G06N 10/00 (2019.01); H01L 24/81 (2013.01); H01L 25/16 (2013.01); H01L 2224/1312 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13105 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13117 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13666 (2013.01); H01L 2224/8112 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01031 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01048 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/04941 (2013.01);
Abstract
A quantum computing system can include a first substrate including one or more quantum control devices. The quantum computing system can include a second substrate including one or more quantum circuit elements. The quantum computing system can include one or more tin contact bonds formed on the first substrate and the second substrate. The tin contact bonds can bond the first substrate to the second substrate. The tin contact bonds can be or can include tin, such as a tin alloy.