The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Aug. 30, 2019
Applicant:

Melexis Technologies NV, Tessenderlo, BE;

Inventors:

Jian Chen, Heist-op-den-Berg, BE;

Appolonius Jacobus Van Der Wiel, Duisburg, BE;

Laurent Otte, Brussels, BE;

Assignee:

MELEXIS TECHNOLOGIES NV, Tessenderlo, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/13 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); G01L 9/0045 (2013.01); G01L 19/0076 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/49541 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/1426 (2013.01);
Abstract

A method of manufacturing a sensor device () comprises providing () a package () having a first die-receiving subframe volume () separated from a second die-receiving subframe volume () by a partition wall (). An elongate sensor element () is disposed () within the package () so as to bridge the first and second subframe volumes () and to overlie the partition wall (). The elongate sensor element () resides substantially in the first subframe volume () and partially in the second subframe volume (). The elongate sensor element () is electrically connected within the second subframe volume ().


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