The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
May. 06, 2019
Texas Instruments Incorporated, Dallas, TX (US);
Robert F. Mortan, McKinney, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A packaged semiconductor device includes a lead frame including plurality of lead terminals each having a plated wettable flank dimple including 2 or more different widths including narrower lead terminals and wider lead terminals. A semiconductor die is attached to the lead frame. A mold material terminates at a saw line of the packaged semiconductor device providing encapsulation except for an exposed bottom contact and an exposed sidewall contact for the plurality of lead terminals. The wider lead terminals have a necked region with a reduced width extending inward a predetermined distance from the saw line, where a terminal region inward beyond the necked region which is wider as compared to the necked region.