The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Oct. 09, 2018
Applicant:
AU Optronics Corporation, Hsinchu, TW;
Inventors:
Ze-Yu Yen, Taipei, TW;
Yi-Fen Lan, Taichung, TW;
Ho-Cheng Lee, Kaohsiung, TW;
Tsung-Tien Wu, Hsinchu County, TW;
Assignee:
Au Optronics Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); B81C 99/00 (2010.01); H01L 21/67 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); B81C 1/00111 (2013.01); B81C 99/002 (2013.01); H01L 21/67144 (2013.01); H01L 21/76877 (2013.01); B81B 2207/056 (2013.01); H01L 21/68 (2013.01);
Abstract
A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.