The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jan. 24, 2020
Applicant:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Inventors:

Joshua Gerdes, Aurora, OR (US);

Jeffrey J. Deloy, Central City, IA (US);

James B. Mayfield, Cedar Rapids, IA (US);

Tristan J. Kendall, Central City, IA (US);

Steven Stowe, Tigard, OR (US);

Assignee:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/324 (2013.01); H01F 2027/2819 (2013.01);
Abstract

A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.


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