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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11599803 B1

PDFFull Text
Date of Patent:
Mar. 07, 2023

Filed:

Mar. 18, 2019

Soldering process parameter suggestion method and system thereof

Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Shu-Han Wu, Taoyuan, TW;

Hung-Wen Chen, Taoyuan, TW;

Ren-Feng Ding, Taoyuan, TW;

Yi-Jiun Shen, Taoyuan, TW;

Yu-Cheng Su, Taoyuan, TW;

Assignee:

DELTA ELECTRONICS, INC., Taoyuan, TW;

Attorney:

CKC & Partners Co., LLC

Primary Examiner:

Michael J Huntley

Assistant Examiner:

Adam C Standke

Int. Cl.
CPC ...
G06N 5/04 (2006.01); G06N 20/00 (2019.01); G06N 20/20 (2019.01); G06N 20/10 (2019.01); G06N 3/08 (2006.01);
U.S. Cl.
CPC ...
G06N 5/04 (2013.01); G06N 20/00 (2019.01); G06N 3/08 (2013.01); G06N 20/10 (2019.01); G06N 20/20 (2019.01);
Abstract

A soldering process method includes steps of: establishing a material component database; establishing a working parameter database; analyzing material and component characteristics required for a new soldering process; comparing the characteristics with information in the material component database; selecting operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; performing the soldering process using the operating parameters corresponding to the material and component characteristics similar to those required for the new soldering process; measuring and recording the soldering process execution information and the final product information; determining whether the final product of the solder process meets the quality control requirements; using the machine learning method to fit the soldering process execution information and the final product information of the solder process to get the operating parameters for the next soldering process when the final product does not meet the quality control requirements.

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Wu, Shu-Han. (2023). Soldering process parameter suggestion method and system thereof (U.S. Patent No. 11599803). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11599803

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