The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jul. 16, 2020
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Bouziane Yebka, Apex, NC (US);

Joseph Anthony Holung, Wake Forest, NC (US);

Tin-Lup Wong, Chapel Hill, NC (US);

Philip John Jakes, Durham, NC (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H01L 23/36 (2006.01); H01L 23/427 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H01L 23/4275 (2013.01);
Abstract

In one aspect, a device may include a housing, at least one processor within the housing, storage accessible to the at least one processor and within the housing, and plural heat absorbers within the housing that may be spherical. Each heat absorber may include an outer shell and inner material. The outer shell may include a shape-memory material. The inner material may include phase-change material different from the shape-memory material. The melting point of the phase-change material may be lower than the melting point of the shape-memory material. The heat absorbers may be juxtaposed with one or more other components of the device to absorb heat from the one or more other components.


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