The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Sep. 03, 2018
Applicant:

Focus-ebeam Technology (Beijing) Co., Ltd., Beijing, CN;

Inventors:

Wei He, Beijing, CN;

Shuai Li, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 23/046 (2018.01); G06T 7/55 (2017.01); G01N 23/2251 (2018.01); G06T 7/70 (2017.01);
U.S. Cl.
CPC ...
G01N 23/046 (2013.01); G01N 23/2251 (2013.01); G06T 7/55 (2017.01); G06T 7/70 (2017.01); G01N 2223/401 (2013.01); G01N 2223/418 (2013.01); G01N 2223/419 (2013.01); G06T 2200/04 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/10081 (2013.01); G06T 2207/30004 (2013.01);
Abstract

An imaging system includes: a micro computed tomography (micro-CT) subsystem, a specimen processing subsystem, a scanning electron microscopy (SEM) and a processor. The micro-CT subsystem includes an X-ray source and an X-ray detector, and is configured to acquire a three-dimensional image of a specimen. The specimen processing subsystem includes a focused ion beam subsystem and a mechanical cutting device. The focused ion beam subsystem is configured to process the specimen in a first processing manner, and the mechanical cutting device is configured to process the specimen in a second processing manner to obtain a target section of a target area. The SEM is located above the specimen and is configured to acquire a two-dimensional image of the target section. The processor is configured to perform three-dimensional reconstruction on the two-dimensional images to obtain a three-dimensional imaging of the specimen.


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