The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jan. 05, 2021
Applicant:

The Texas A&m University System, College Station, TX (US);

Inventors:

Choongho Yu, College Station, TX (US);

Hong Wang, College Station, TX (US);

Gang Yang, College Station, TX (US);

Assignee:

The Texas A&M University System, College Station, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); F28F 21/02 (2006.01); H01L 23/373 (2006.01); C01B 32/158 (2017.01); C08K 3/04 (2006.01); C08J 5/00 (2006.01); C01B 32/168 (2017.01); C22C 32/00 (2006.01); C23C 16/26 (2006.01); F28F 21/06 (2006.01); F28F 21/08 (2006.01); H01L 23/433 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C01B 32/158 (2017.08); C01B 32/168 (2017.08); C08J 5/005 (2013.01); C08K 3/041 (2017.05); C22C 32/0084 (2013.01); C23C 16/26 (2013.01); F28F 21/02 (2013.01); F28F 21/06 (2013.01); H01L 23/373 (2013.01); H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 2202/24 (2013.01); C08J 2383/04 (2013.01); F28F 21/08 (2013.01); F28F 2255/06 (2013.01); H01L 23/433 (2013.01);
Abstract

A method of forming an polymer composites is disclosed herein that includes infiltrating CNT sponges with a polymer or metal to form a composite. The method uses a relatively easy, scalable, and low-cost synthesis process that makes the composites attractive as TIM. CNTs in the sponge structure are covalently bonded, resulting in a low Young's modulus while at the same time maintaining a good thermal conductivity. This strategy makes it possible to obtain both high deformability and high thermal conductivity, which are difficult to have simultaneously due to their adverse correlation.


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