The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jul. 14, 2021
Applicant:

Tatsuta Electric Wire & Cable Co., Ltd., Osaka, JP;

Inventor:

Yuusuke Haruna, Kizugawa, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); H05K 3/32 (2006.01); C09J 201/00 (2006.01); C09J 11/04 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); H05K 3/321 (2013.01);
Abstract

There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur. A conductive adhesiveincludes a binder component, and metal particles (A)having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particlespreferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A)is preferably 80% by mass or more.


Find Patent Forward Citations

Haruna, Yuusuke. (2023). Conductive adhesive (U.S. Patent No. 11597858). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11597858

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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