The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jan. 17, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Changbo Shim, Daejeon, KR;
Yongseon Hwang, Daejeon, KR;
Hwayeon Moon, Daejeon, KR;
Hee Yong Shim, Daejeon, KR;
Hyunsung Min, Seoul, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08L 71/12 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); C08K 9/04 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 5/02 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08J 5/244 (2021.05); C08K 3/36 (2013.01); C08K 9/04 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); C08J 2371/12 (2013.01); C08J 2409/06 (2013.01); C08J 2483/04 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01);
Abstract
The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.