The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jul. 26, 2016
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Devin Alexander Mourey, Corvallis, OR (US);
Michael W. Cumbie, Corvallis, OR (US);
Si-lam Choy, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0292 (2013.01); B81B 2201/058 (2013.01);
Abstract
A device includes: a die including a microfluidic device; a polymer substrate formed around the die; and a separate fluid manifold attached to the polymer substrate over the die and on a same side of the substrate as the die, the manifold to deliver fluid to the die.