The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jun. 25, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Chien-Hua Chen, Corvallis, OR (US);

Michael W. Cumbie, Corvallis, OR (US);

Si-Iam J. Choy, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14145 (2013.01); B41J 2/14201 (2013.01); B41J 2/1601 (2013.01); B41J 2/1607 (2013.01); B41J 2/1637 (2013.01);
Abstract

A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.


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