The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jan. 21, 2020
Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Yusuke Kubo, Shimotsuke, JP;

Keisuke Aramaki, Shimotsuke, JP;

Assignee:

DEXERIALS CORPORATION, Shimotsuke, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/18 (2006.01); B32B 7/027 (2019.01); B29C 70/58 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B29K 83/00 (2006.01); B29K 307/04 (2006.01); B29L 7/00 (2006.01); F28F 21/06 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
B32B 37/182 (2013.01); B29C 70/58 (2013.01); B32B 7/027 (2019.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B29K 2083/00 (2013.01); B29K 2307/04 (2013.01); B29K 2995/0013 (2013.01); B29L 2007/002 (2013.01); B32B 2262/106 (2013.01); B32B 2307/302 (2013.01); F28F 21/06 (2013.01); F28F 2255/06 (2013.01); H01L 23/3733 (2013.01);
Abstract

A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm/W or less.


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