The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Sep. 11, 2019
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jinyoung Park, Daejeon, KR;

Jinho Lee, Daejeon, KR;

Chae Won Park, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 3/30 (2006.01); B32B 7/06 (2019.01); B32B 17/10 (2006.01); B32B 38/10 (2006.01); C08G 73/10 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B32B 3/30 (2013.01); B32B 7/06 (2013.01); B32B 17/10 (2013.01); B32B 17/101 (2013.01); B32B 17/10568 (2013.01); B32B 17/10697 (2013.01); B32B 38/10 (2013.01); C08G 73/1007 (2013.01); C08G 73/1067 (2013.01); H01L 27/1262 (2013.01); H01L 27/3262 (2013.01); B32B 2305/72 (2013.01); B32B 2307/30 (2013.01); B32B 2307/546 (2013.01); B32B 2457/20 (2013.01);
Abstract

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350° C., as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process.


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