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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11597137 B1

PDFFull Text
Date of Patent:
Mar. 07, 2023

Filed:

Oct. 03, 2018

Method of forming pattern of cured product as well as production methods for processed substrate, optical component, circuit board, electronic component, imprint mold and imprint pretreatment coating material

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Jun Kato, Utsunomiya, JP;

Takeshi Honma, Tokyo, JP;

Toshiki Ito, Kawasaki, JP;

Hidetoshi Tsuzuki, Yokohama, JP;

Assignee:

CANON KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Venable LLP

Primary Examiner:

Xiao S Zhao

Assistant Examiner:

John J DeRusso

Int. Cl.
CPC ...
B29C 59/16 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01); B29C 59/00 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); G03F 7/027 (2006.01); B29K 33/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/16 (2013.01); B29C 59/002 (2013.01); B29C 59/007 (2013.01); G03F 7/0002 (2013.01); G03F 7/027 (2013.01); G03F 7/161 (2013.01); H01L 21/022 (2013.01); H01L 21/0273 (2013.01); B29C 2791/005 (2013.01); B29K 2033/12 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

Provided is a method of producing a cured product pattern, including: a first step (arranging step) of arranging a layer formed of a curable composition (α') that is the components of the curable composition (α) except the component (D) serving as a solvent on a substrate; and a second step (applying step) of applying droplets of a curable composition (α) discretely onto the layer formed of the curable composition (α), the curable composition (α) having a number concentration of particles each having a particle diameter of 0.07 μm or more of less than 2,021 particles/mL, and the curable composition (α′) having a surface tension larger than that of the curable composition (α).

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