The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Aug. 20, 2019
Applicant:
Smith & Nephew, Inc., Memphis, TN (US);
Inventors:
Vivek D. Pawar, Germantown, TN (US);
John Rose, Collierville, TN (US);
Carolyn Weaver, Collierville, TN (US);
Assignee:
Smith & Nephew, Inc., Memphis, TN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 8/10 (2006.01); A61L 31/16 (2006.01); A61L 27/54 (2006.01); A61L 31/02 (2006.01); A61L 31/14 (2006.01); A61L 27/04 (2006.01); A61L 27/50 (2006.01); A61L 27/06 (2006.01); A61L 27/30 (2006.01); A61L 31/08 (2006.01); C22F 1/18 (2006.01); C23C 14/02 (2006.01); C23C 14/16 (2006.01); C23C 14/24 (2006.01); C23F 17/00 (2006.01); C23C 8/00 (2006.01);
U.S. Cl.
CPC ...
A61L 31/16 (2013.01); A61L 27/04 (2013.01); A61L 27/047 (2013.01); A61L 27/06 (2013.01); A61L 27/30 (2013.01); A61L 27/50 (2013.01); A61L 27/54 (2013.01); A61L 31/022 (2013.01); A61L 31/088 (2013.01); A61L 31/14 (2013.01); C22F 1/183 (2013.01); C23C 14/028 (2013.01); C23C 14/16 (2013.01); C23C 14/24 (2013.01); C23F 17/00 (2013.01); A61L 2300/104 (2013.01); A61L 2300/404 (2013.01); A61L 2300/606 (2013.01); A61L 2400/18 (2013.01); A61L 2430/02 (2013.01);
Abstract
A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.