The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Aug. 20, 2018
Applicant:
Olympus Corporation, Hachioji, JP;
Inventors:
Yu Murano, Tokyo, JP;
Takuya Fujihara, Tokyo, JP;
Takeshi Deguchi, Tokyo, JP;
Hiroaki Kasai, Tokyo, JP;
Kohei Shiramizu, Kawasaki, JP;
Assignee:
OLYMPUS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61L 31/12 (2006.01); A61L 31/10 (2006.01); A61L 31/08 (2006.01); A61B 18/14 (2006.01); A61B 18/12 (2006.01); H01B 1/22 (2006.01); B32B 27/00 (2006.01); B32B 27/18 (2006.01); A61B 18/00 (2006.01);
U.S. Cl.
CPC ...
A61L 31/128 (2013.01); A61B 18/12 (2013.01); A61B 18/14 (2013.01); A61B 18/1402 (2013.01); A61B 18/1445 (2013.01); A61L 31/088 (2013.01); A61L 31/10 (2013.01); B32B 27/00 (2013.01); B32B 27/18 (2013.01); H01B 1/22 (2013.01); A61B 2018/0013 (2013.01); A61B 2018/0063 (2013.01); A61B 2018/00077 (2013.01); A61B 2018/00101 (2013.01); A61B 2018/00589 (2013.01); A61B 2018/00595 (2013.01); A61B 2018/00601 (2013.01); A61B 2018/1412 (2013.01); A61L 2420/04 (2013.01);
Abstract
This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.