The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Oct. 31, 2018
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventor:

Jun Song, San Diego, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); A61B 8/00 (2006.01); A61B 8/08 (2006.01); A61B 8/12 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
A61B 8/445 (2013.01); A61B 8/0891 (2013.01); A61B 8/12 (2013.01); H05K 1/189 (2013.01); H05K 3/305 (2013.01); H05K 3/3421 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Intraluminal ultrasound imaging device, systems and methods (e.g., method of fabricating the device) are provided. In some embodiments, the intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient, and an ultrasound scanner assembly disposed at a distal portion of the flexible elongate member and configured to obtain imaging data of the body lumen. The ultrasound scanner assembly includes a flexible substrate, a first under-bump metallization (UBM) layer over the flexible substrate, a first solder feature over the first UBM layer, and a first electronic component electrically connected to the first solder feature.


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