The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Apr. 22, 2021
Applicant:

Emc Ip Holding Company Llc, Hopkinton, MA (US);

Inventors:

Kunzheng Zhang, Shanghai, CN;

Sandburg Hu, Shanghai, CN;

Aric Hadav, Tel Aviv, IL;

Xiang Yu, Shanghai, CN;

Yuxin Chen, Shanghai, CN;

Assignee:

EMC IP Holding Company LLC, Hopkinton, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0069 (2013.01); H05K 5/026 (2013.01); H05K 5/0291 (2013.01); H05K 7/1435 (2013.01);
Abstract

An electronic equipment assembly has an interconnect including columns of signal conductors, connectors mounted to the columns of signal conductors, and a chassis coupled with the interconnect. The chassis provides slots that guide resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices. At least one column of the columns of signal conductors of the interconnect is a multi-function column. Each multi-function column is constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column.


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