The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Jan. 27, 2020
Applicant:

Botfactory Inc., Long Island City, NY (US);

Inventors:

Michael Knox, Manhasset, NY (US);

Andrew Ippoliti, Sunnyside, NY (US);

Georgios Kyriakou, New York, NY (US);

Carlos Ospina, New York, NY (US);

Nicolas Vansnick, Brooklyn, NY (US);

Assignee:

BOTFACTORY INC., Long Island City, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); H05K 3/12 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); G01R 31/2805 (2013.01); H05K 2203/013 (2013.01); H05K 2203/162 (2013.01); H05K 2203/167 (2013.01);
Abstract

An apparatus for producing a printed circuit board on a substrate, has a table for supporting the substrate, a function head configured to effect printing conductive and non-conductive materials on the substrate, a positioner configured to effect movement of the function head relative to the table, and a controller configured to operate the function head and the positioner to effect the printing of conductive and non-conductive materials on the substrate. The apparatus optionally has a layout translation module configured to convert PCB files or multilayer PCB files to printing data for controlling the function head to print conductive material and nonconductive material onto the substrate. The apparatus has a testing head to verify conductors which operates automatically. The translation module also prints nonconductive material component alignment areas and nonconductive material substrate stiffeners.


Find Patent Forward Citations

Loading…