The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Jun. 22, 2021
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Jie Wang, Beijing, CN;
Chunjian Liu, Beijing, CN;
Jie Lei, Beijing, CN;
Jian Tian, Beijing, CN;
Xintao Wu, Beijing, CN;
Qin Zeng, Beijing, CN;
Zouming Xu, Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
The present disclosure provides a substrate motherboard including: a first substrate base, a first conductive pattern layer, at least one first insulating layer and a second conductive pattern layer which are sequentially arranged. The first conductive pattern layer includes a plurality of signal lines in the active region. The second conductive pattern layer includes a plurality of connection terminals in the active region, and the plurality of connection terminals are electrically coupled to corresponding signal lines in the plurality of signal lines. The substrate motherboard further includes a plurality of leading-out wires and a plurality of detection terminals in the non-active region, first ends of the plurality of leading-out wires are electrically coupled to corresponding connection terminals and extending to the non-active region to be electrically coupled to corresponding detection terminals through second ends thereof.