The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

May. 28, 2021
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Arata Yagi, Makinohara, JP;

Isanori Shimizu, Makinohara, JP;

Masataka Nagayama, Makinohara, JP;

Shinji Ohtsuka, Makinohara, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/631 (2006.01); H01R 13/405 (2006.01);
U.S. Cl.
CPC ...
H01R 13/631 (2013.01); H01R 13/405 (2013.01);
Abstract

A resin molded product includes a plate portion having a plate-like shape and having assembly locations in which a mating member is assembled on both surfaces of the plate portion in a plate thickness direction, a reference portion provided on one surface of the plate portion and used for alignment with the mating member, and a through hole which penetrates the reference portion in the plate thickness direction and opens on the both surfaces of the plate portion. The reference portion has a columnar shape extending in the plate thickness direction, and the through hole opens at an extending end of the reference portion and extends in the plate thickness direction to open on the other surface of the plate portion. The plate portion further includes a terminal provided so as to extend in the plate thickness direction at the assembly location on the other surface.


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