The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Dec. 11, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Taesik Yang, San Diego, CA (US);

Mohammad Ali Tassoudji, San Diego, CA (US);

Jeongil Jay Kim, San Diego, CA (US);

Darryl Sheldon Jessie, San Diego, CA (US);

Kevin Hsi-Huai Wang, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 5/307 (2015.01); H01Q 1/24 (2006.01); H01Q 19/10 (2006.01); H01Q 1/48 (2006.01); H01Q 21/10 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/065 (2013.01); H01Q 1/24 (2013.01); H01Q 1/48 (2013.01); H01Q 5/307 (2015.01); H01Q 19/10 (2013.01); H01Q 21/0006 (2013.01); H01Q 21/10 (2013.01);
Abstract

Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.


Find Patent Forward Citations

Loading…