The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Dec. 14, 2021
Applicant:
Agc Inc., Tokyo, JP;
Inventors:
Shuhei Nomura, Tokyo, JP;
Kazutaka Ono, Tokyo, JP;
Assignee:
AGC Inc., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 15/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01Q 15/0013 (2013.01);
Abstract
Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}≤300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.