The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Dec. 18, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Kenta Ishii, Tokyo, JP;

Masaru Nanao, Tokyo, JP;

Hitoshi Sakuma, Tokyo, JP;

Takao Noguchi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/04 (2006.01); H01L 41/047 (2006.01); H01L 41/08 (2006.01); C23C 16/48 (2006.01); C23C 16/06 (2006.01); C23C 14/08 (2006.01); C23C 14/34 (2006.01); C23C 16/40 (2006.01); H01L 41/187 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0477 (2013.01); C23C 14/088 (2013.01); C23C 14/34 (2013.01); C23C 16/06 (2013.01); C23C 16/405 (2013.01); C23C 16/487 (2013.01); H01L 41/0815 (2013.01); H01L 41/187 (2013.01);
Abstract

A thin film laminate comprises a metal layer consisting of a metal, and a thin film laminated on the surface of the metal layer, wherein a first direction is defined as one direction parallel to the surface of the metal layer, and a second direction is defined as one direction parallel to the surface of the metal layer and crossing the first direction; and the metal layer contains a plurality of first metal grains consisting of the metal and extending in the first direction on the surface of the metal layer, and a plurality of second metal grains consisting of the metal and extending in the second direction on the surface of the metal layer.


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