The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

May. 19, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Seungjin Yoon, Hwaseong-si, KR;

Hosik Jun, Hwaseong-si, KR;

Sangbok Yun, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/56 (2013.01);
Abstract

A light emitting diode (LED) package is provided. The LED package includes a package body having a concave portion; an LED chip disposed on the concave portion; a phosphor sheet disposed on the LED chip; a barrier wall disposed on the concave portion and spaced apart from the LED chip by a first distance, the barrier wall being disposed in parallel with at least one side surface of the LED chip, an upper surface of the barrier wall being higher than an upper surface of the LED chip with respect to the lower surface of the concave portion and disposed at a level that is 50 μm or less from an upper surface of the phosphor sheet; and an encapsulation portion disposed on the LED chip, a side surface of the phosphor sheet and a side surface of the barrier wall.


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