The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Jan. 08, 2021
Sony Corporation, Tokyo, JP;
Atsushi Yamamoto, Kanagawa, JP;
Shinji Miyazawa, Kanagawa, JP;
Yutaka Ooka, Kanagawa, JP;
Kensaku Maeda, Kanagawa, JP;
Yusuke Moriya, Kanagawa, JP;
Naoki Ogawa, Kumamoto, JP;
Nobutoshi Fujii, Kanagawa, JP;
Shunsuke Furuse, Kanagawa, JP;
Masaya Nagata, Kanagawa, JP;
Yuichi Yamamoto, Kanagawa, JP;
SONY CORPORATION, Tokyo, JP;
Abstract
The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.