The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Mar. 16, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Ayumi Watarai, Ama, JP;

Taichi Iwasaki, Yokkaichi, JP;

Osamu Matsuura, Kuwana, JP;

Yu Hirotsu, Kuwana, JP;

Sota Matsumoto, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11578 (2017.01); H01L 27/11519 (2017.01); H01L 27/11521 (2017.01); H01L 27/11526 (2017.01); G11C 8/14 (2006.01); H01L 27/11565 (2017.01); H01L 27/11568 (2017.01); H01L 27/11573 (2017.01); H01L 27/11551 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11578 (2013.01); G11C 8/14 (2013.01); H01L 27/11519 (2013.01); H01L 27/11521 (2013.01); H01L 27/11526 (2013.01); H01L 27/11551 (2013.01); H01L 27/11565 (2013.01); H01L 27/11568 (2013.01); H01L 27/11573 (2013.01);
Abstract

A semiconductor memory device according to an embodiment includes a substrate, a source line, word lines, a pillar, an outer peripheral conductive layer, a lower layer conductive layer, and a first contact. The substrate includes a core region and a first region. The outer peripheral conductive layer is provided to surround the core region in the first region. The outer peripheral conductive layer is included in a first layer. The lower layer conductive layer is provided in the first region. The first contact is provided on the lower layer conductive layer to surround the core region in the first region. An upper end of the first contact is included in the first layer. The first contact is electrically connected to the outer peripheral conductive layer.


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