The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Oct. 05, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Naruhiro Yoshida, Tokyo, JP;

Takuya Kimoto, Kanagawa, JP;

Seiichiro Fukai, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/552 (2006.01); H03B 5/12 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/552 (2013.01); H03B 5/12 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06575 (2013.01);
Abstract

A semiconductor device includes a plurality of semiconductor chips disposed in a vertical form through a spacer, in which a shield layer having a thickness such that an electromagnetic field radiation generated from a generation source of the semiconductor chip can sufficiently be absorbed is disposed between the semiconductor chips.


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