The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Mar. 12, 2020
Applicant:
Kioxia Corporation, Minato-ku, JP;
Inventors:
Kazuhiro Nakanishi, Yokkaichi, JP;
Shigehiro Yamakita, Yokkaichi, JP;
Kazuhiro Nojima, Mie, JP;
Kenichi Kadota, Yokkaichi, JP;
Assignee:
Kioxia Corporation, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/89 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05563 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract
In one embodiment, a semiconductor device includes a substrate, a lower pad provided above the substrate, and an upper pad provided on the lower pad. The lower pad includes a first pad and a plurality of first connection portions provided on the first pad, and the upper pad is provided on the plurality of first connection portions, or the upper pad includes a second pad and a plurality of second connection portions provided under the second pad, and the lower pad is provided under the plurality of second connection portions.