The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Dec. 26, 2019
Applicant:

3d Glass Solutions, Inc., Albuquerque, NM (US);

Inventors:

Jeb H. Flemming, Albuquerque, NM (US);

Kyle McWethy, Albuquerque, NM (US);

Assignee:

3D Glass Solutions, Inc., Albuquerque, NM (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/051 (2006.01); H01L 21/48 (2006.01); H01L 23/544 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/051 (2013.01); H01L 21/4817 (2013.01); H01L 21/4871 (2013.01); H01L 23/544 (2013.01); H01L 23/66 (2013.01); H01L 2223/54426 (2013.01);
Abstract

The present invention includes a method for creating a system in a package with integrated lumped element devices and active devices on a single chip/substrate for heterogeneous integration system-on-chip (HiSoC) in photo-definable glass, comprising: masking a design layout comprising one or more electrical passive and active components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass.


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